Fukushima Koriyama Plant, Kyocera Corporation

“The New Value Frontier”



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  • Location 〒963-0215
    2-17 Machiikedai Koriyama City, Fukushima
  • Representative Fukushima Koriyama Plant Manager, Akira Morito
  • Foundation 1991
  • Capital 115,703 Million Yen
  • Number of employees 194
  • Industry Chemical

Business Overview

Develop and manufacture epoxy molding compounds for semiconductors

Product / Commodity Name

Epoxy molding compounds for semiconductors

Message from a Representative

Fukushima Koriyama Plant marks 27 years of operation of epoxy molding compounds for semiconductors. Our organic materials are widely used across many industries including digital equipments, automobiles, energy, environmental protection etc. We continue to be a frontier to meet the expectation of our customers through delivering cutting-edge products worldwide.

Technology You Want to Offer

We have the state-of-the-art testing facilities to develop materials for the latest package industry. This enables us to develop products to quickly satisfy the needs of customers and to create technological innovations. We are developing cutting-edge materials for next-generation devices in the recent years, creating higher technologies through our fundamental technology and knowledge so as to contribute to the transmission to a low-carbon society via environmental load reduction and energy saving activities. We deliver cutting-edge materials in powder state for compression molding and in highly pure state for copper wire bonding as well as our existing materials for transfer molding.